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Bahareh Banijamali, 38, Los Altos, Vineyard Dr
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Interests
U.S. Patents Awarded to Inventors in California (April 28)
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... has been assigned a patent (8,704,364) developed by Bahareh Banijamali, Los Altos, Calif., for "reducing stress in multi-die integrated circuit ...
Bahareh Banijamali - Patents
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Bahareh Banijamali patents. Recent bibliographic sampling of Bahareh Banijamali patents listed/published in the public domain by the USPTO (USPTO Patent ...
Xilinx Assigned Patent for Reducing Stress in Multi-die Integrated...
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Xilinx Assigned Patent for Reducing Stress in Multi-die Integrated Circuit Structures
Management & Stakeholders
Bahareh Banijamali - MarketVisual Knowledge Map
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Current Affiliations. General Employment. ENGINEER at San Jose State University. Non-Corporate Leadership. LECTURER at San Jose State University.
Business Profiles
patentbuddy: Bahareh Banijamali
XILINX, INC.
Various - Massachusetts Institute of Technology
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TA Contact Info Bahareh Banijamali Room email:< - Office hours: Tuesdays 5-7 pm News. First day of class is February 4th; Project proposal due February 27th, 2003
MIT Finite Element Research Group webpage
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Hi, here's who works at the finite element research lab at MIT: ... Jung-Wuk Hong: Bahareh Banijamali: Phill-Seung Lee: Jacques Olivier : SeongHwa Park : …
Private Homepages
Bahareh Banijamali's Email - ContactOutcontactout.com › Bahareh-Banijamali
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Bahareh Banijamali's Email and Phone. Sr Technical Program Manager, Director @ NVIDIA. Bahareh Banijamali's Email. . View Bahareh's ...
Books & Literature
Design and Modeling for 3D ICs and Interposers - Madhavan Swaminathan...
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... of Solid State Circuits, pp –1725, Vol. 41, No. 8, August [Madden et al., 2012] Liam Madden, Ephrem Wu, Namhoon Kim, Bahareh Banijamali ...
Development of a Flow-condition-based Interpolation 9-node Element...
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Bahareh Banijamali, Massachusetts Institute of Technology. Dept. of Civil and Environmental Engineering. Massachusetts Institute of Technology, Department of ...
Related Documents
Interconnect and package design of a heterogeneous stacked-silicon...
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Bahareh Banijamali. This author has not been identified. Look up 'Bahareh Banijamali' in Google · Suresh Ramalingam. This author has not been identified.
CiteSeerX — The CIP method embedded in finite element discretizations...
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BibTeX @MISC{Banijamali07thecip, author = {Bahareh Banijamali and Klaus-Jürgen Bathe}, title = {The CIP method embedded in finite element discretizations of incompressible fluid flows}, year = {2007}}
Advanced Thermal Study of Very High Power TSV Interposer ...imapsource.org › doi › abs › isom WP1-Paper2
meridian.allenpress.com
Bahareh Banijamali, Suresh Ramalingam, and Raghunandan Chaware (2011) Advanced Thermal Study of Very High Power TSV Interposer and Interconnects ...
Publications
Development of a flow-condition-based interpolation 9-node element...
core.ac.uk
Development of a flow-condition-based interpolation 9-node element for incompressible flows. By Bahareh Banijamali. Abstract. Includes bibliographical ...
Video & Audio
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Reports & Statements
Google Groups: Is Soccer on this Saturday?
: bahareh banijamali ... perspolis_e_zelzeleh This Saturday is ... Bahareh Banijamali Ph.D. in Structures & Materials, MIT Senior Packaging ...
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Google Groups: Football this Sat.
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Miscellaneous
Bahareh Banijamali | LinkedIn
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Bahareh Banijamali. Sr Technical Program Manager, Principal Engineer at NVIDIA. Standort Los Altos, California Branche Halbleiter
Bahareh Banijamali | LinkedIn
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Join LinkedIn and access Bahareh’s full profile Outstanding and Innovative Reliability Study of 3D TSV interposer and Fine Pitch Solder micro-bumps Advanced Reliability Study of TSV interposers and interconnects for the 28nm technology FPGA.
US B2 - Strong interconnection post geometry Google...
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A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a...
EP A1 - Through silicon via with improved reliability
patents.google.com
Inventores, Arifur Rahman, Bahareh Banijamali. Requerente, Xilinx, Inc. Exportar citação, BiBTeX, EndNote, RefMan. Classificações (14), Eventos Legais (3).
US A1 - Reducing stress in multi-die integrated circuit...
patents.google.com
An integrated circuit structure can include a first interposer and a second interposer. The first interposer and the second interposer can be coplanar....
Bahareh Banijamali | Xperi Corporation | Email Senior Mechanical...
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Email, phone number & executive profile for Bahareh Banijamali, Senior Mechanical Engineer of Xperi Corporation at San Jose, CA
Bahareh banijamali - ksoa.net
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Bahareh Banijamali and Ilyas Mohammed Tessera Orchard Dr. San Jose CA ,USA ABSTRACT Flip-chip technology has been …
Bahareh Banijamali in Mountain View, CA - Listing Details - Yellow...
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Bahareh Banijamali is located in Mountain View CA according to public information records. First Name, Phone Number, Name Origin and Meaning for the person...
Bahareh Banijamali Vineyard Dr, Los Altos, Ca
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Property record for VINEYARD DR, LOS ALTOS, CA which is owned by Bahareh Banijamali.
Bahareh Banijamali - 搜狗学术
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Bahareh Banijamali and Ilyas Mohammed Tessera Orchard Dr. San Jose CA ,USA ABSTRACT Flip-chip technology has ...
2 - MITstuff.mit.edu › afs › athena › course › outline
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Bahareh Banijamali. Room: , Tel x Office hours: Tuesdays 5-7 pm. Prerequisites: Undergraduate statics and mathematics.
REDUCING STRESS IN MULTI-DIE INTEGRATED CIRCUIT STRUCTURES - Patent...
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Patent application title: REDUCING STRESS IN MULTI-DIE INTEGRATED CIRCUIT STRUCTURES Inventors: Bahareh Banijamali (Los Altos, CA, US) Assignees: Xilinx, Inc.
MEMBERS — AFTAB DANCE GROUPwww.aftabdancegroup.com › members
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... Taraneh Paravar, Bahareh Banijamali, Pegah Karimi, Jeiran Jahani, Sara Sarkhili, Ghazaleh Shafai, Golnaz Goodarzi, Ghazaleh Nekui, and Jessica Brioso .
Advancing high performance heterogeneous integration through die...
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Liam Madden, Ephrem Wu, Namhoon Kim, Bahareh Banijamali, Khaldoon Abugharbieh, Suresh Ramalingam, Xin Wu ... Bahareh Banijamali.
5th Annual International Wafer-Level Packaging Conference & Tabletop...
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... Ph.D., LORD Corporation 169 μpilr Embedded Package Technology for Mobile Applications Carl Ryu, Bahareh Banijamali, Ilyas Mohammad ...
Fine Pitch Datasheets, Manuals, Linecards, Case Studies, & PDFs
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Reliability of Fine-Pitch Flip-Chip Packages Bahareh Banijamali, ... technology that leverages the existing fine pitch flip-chip technologies is discussed ... to those ...
Reliability evaluation of a CoWoS-enabled 3D IC package
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Bahareh Banijamali, Chien-Chia Chiu, Cheng-Chieh Hsieh, Tsung-Shu Lin, Clark Hu, Shang-Yun Hou, Suresh Ramalingam, Shin-Puu Jeng, Liam Madden, ...
THROUGH SILICON VIA WITH IMPROVED RELIABILITY - Patent application
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Patent applications by Bahareh Banijamali, Los Altos, CA US Patent applications by Xilinx, Inc
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