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Novellus' Ultra Low Dielectric Constant Materials Enable 32nm Device...

www.finanznachrichten.de
12 Jun films without adding complexity to the integration sequence," said Andy Antonelli, technology manager at Novellus' PECVD business unit. ...

Thank You!

gymmomentum.com
Frank DeFrancesco, Andy Antonelli who were clinicians at my first Region 6 Mini Congress when I was just starting out as a coach. You shared so many drills with me. I am just passing them on. Kip Reed who was also a ...

Dense ULK and Diffusion Barrier Stack Absorbs Order-of-Magnitude ...

www.azonano.com
"Some 32nm ULK inter-metal dielectric and diffusion barrier films can be negatively impacted by UVTP, changing the stress on the underlying copper-dielectric interface," said Andy Antonelli, technology manager at Novellus' ...

Novellus devises dense ultra-low dielectric films | EDN

www.edn.com
... adding complexity to the integration sequence", said Andy Antonelli, technology manager at Novellus' PECVD business unit, in a statement.
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