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ARM Artisan Low-Power IP for 130-Nanometer Process Selected by UMC
www.finanznachrichten.de
... committed to providing customers with the latest technologies that address power-management issues for nanometer design,' said Ken Liou, ...
Sarnoff Europe and UMC sign IP Alliance for ESD protection
www10.edacafe.com
solutions to our IP Alliance Program, UMC can provide its fabless customers easy access to superior ESD design solutions from an industry wide recognized leader in its field," Ken Liou, director of the IP and Design Support Division at UMC.
Chipidea's USB 2.0 OTG High Speed IP Core Silicon Proven on UMC's...
www.design-reuse.com
Chipidea's USB 2.0 OTG High Speed IP Core Silicon Proven on UMC's 0.13um Technology
Apache Addresses Critical Area of Power and Thermal Management in...
www.apache-da.com
Apache Addresses Critical Area of Power and Thermal Management in UMC’s 90nm Reference Design “Apache delivers key technologies required to address the design challenges at 90nm and below,” said Ken Liou, director of the IP and Design Support division at UMC. “Accuracy and ease-of-use of RedHawk and Sahara are the key reasons why ...
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