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Mehrdad Mahanpour, 58, San Jose, US, Fruitdale Ave
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Mehrdad M Mahanpour, 58, Union City, US, Pomponi St
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Mehrdad Catherine Mahanpour, 58, Fremont, US, Milburn Ter
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Mehrdad Catherine Mahanpour, 58, Union City, US, Beacon Bay Dr
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Network Profiles
Interests
Mehrdad Mahanpour - Patents
www.freshpatents.com
Mehrdad Mahanpour patents Recent bibliographic sampling of Mehrdad Mahanpour patents listed/published in the public domain by the USPTO (USPTO Patent ...
Mehrdad Mahanpour, Inventor, Union City, CA
www.patentbuddy.com
Mehrdad Mahanpour's Inventor profile, Union City, CA, US, ADVANCED MICRO DEVICES, INC.;, 27 patents/applications from Dec 18, to Mar 01, 2004,
Business Profiles
patentbuddy: Mehrdad Mahanpour
ADVANCED MICRO DEVICES, INC., Union City, CA, US
Mehrdad Mahanpour - Business Profile | Cisco Systems, Inc ...www.zoominfo.com › Mehrdad-Mahanpour
www.zoominfo.com
View Mehrdad Mahanpour's business profile as Diagnostic Engineer at Cisco Systems, Inc.. Find contact's direct phone number, email address, work history, ...
Education
classmates: Mehrdad Mahanpour
North Dakota State University, Fargo, ND,
Books & Literature
Istfa '98: Proceedings of the 24Th International Symposium for...
books.google.de
Mehrdad Mahanpour, Andy Gray, Jose Hulog, Pat Chang Advanced Micro Devices Sunnyvale, California Acknowledgment The authors would like to thank the ...
ISTFA 2014: Conference Proceedings from the 40th ...books.google.ca › books
books.google.ca
... dissipates easier. References 1. Mehrdad Mahanpour, “Emission microscope and passive voltage contrast: Solving a problem quickly”, III-Vs Review, Volume ...
Istfa 2005: Proceedings of the 31st International Symposium for...
books.google.de
Caiwen Yuan, Mehrdad Mahanpour, Hung-Jen Lin, Gene Hill, “Application of Focused Ion Beam in Debug and Characterization of m Copper Interconnect ...
Istfa 2001: Proceedings of the 27Th International Symposium ...books.google.ca › books
books.google.ca
... Chair Edward Budiarto Aaron Falk Manuel Gonzalez Christopher Henderson Mehrdad Mahanpour Dave Vallett Sandia National Laboratories. Albuquerque ...
Related Documents
Emission microscope and passive voltage contrast: Solving a problem...
vdocuments.mx
, ~ N ~ ~,~%~:~ ~,, ~gi ~ ~:~:~, ,~,~:~: : :~ ,~ ,~ , ,~ Emission Microscope and...
[ESD Assoc Electrical Overstress/Electrostatic Discharge Symposium...
pdfslide.net
Transient Latch-Up Using an Improved Bi-polar Trigger Ian Morgan, Colin Hatchard', Mehrdad Mahanpour Advanced Micro Devices, One AMD Place, M / S 66,...
Miscellaneous
Mehrdad Mahanpour | LinkedIn
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View Mehrdad Mahanpour’s professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Mehrdad Mahanpour ...
CN A - 三维结构的离子辅助等离子处理 Google Patents
patents.google.com
US A1 * Mehrdad Mahanpour Method and system for reducing polymer build up during plasma etch of an intermetal ...
US A - Support structure for use during package removal from a...
patents.google.com
Aspects for supporting a package and a device coupled to the package at a device frontside during package removal at a package backside are described. In...
US B1 - Method and system for selectively disconnecting a...
patents.google.com
A system and method for identifying a location of a short in a circuit of a semiconductor device is disclosed. The method and system includes providing a...
Mehrdad Mahanpour and Joanne Steenburgh | Pomponi Street, Union...
blockshopper.com
Mehrdad Mahanpour and Joanne Steenburgh, Pomponi Street, Union City, CA Find homes for sale, market statistics, foreclosures, property taxes, real...
Pomponi Street, Union City, CA | BlockShopper.com
blockshopper.com
Find homes for sale, market statistics, foreclosures, property taxes, real estate news, agent reviews, condos, neighborhoods on Blockshopper.com
US B1 - Method and apparatus for identifying individual die...
patents.google.com
A method and apparatus for identifying individual semiconductor die that originate from a semiconductor substrate containing a plurality of die is...
WO A2 - Espaceur de conversion en siliciure ...www.google.co.in › patents
patents.google.com
Other languages: English; Inventor: Jeffrey P. Patton: Mehrdad Mahanpour: Thorsten Kammler: David E. Brown: Paul R. Besser: Simon Siu-Sing Chan: Austin C.
US A1 - Method and system for reducing polymer build up...
patents.google.com
A method and system for deprocessing a semiconductor device is disclosed. The semiconductor device has a plurality of structures and an intermetal...
Residents of Flying Cloud Isle, Foster City, California: who are ...neighbor.report › Foster-City › Flying-Cloud-Isle
neighbor.report
Persons living here: Cathy Gamache, Mehrdad Mahanpour. See Details · 189 · 189 Flying Cloud Isle. Persons living here: Ellen Dobel. Property Build Year: ...
US B1 - Process to decapsulate a FBGA package Google...
patents.google.com
A fixture assembly of a unique construction is provided for use with a decapsulating machine so as to prevent damage to a FBGA package during...
US B1 - Detecting heat generating failures in unpassivated...
patents.google.com
A method and semiconductor device for detecting a heat generating failure in an unpassivated semiconductor device. The semiconductor device has an...
WO A3 - Siliciding spacer in integrated circuit technology...
patents.google.com
Inventors, Paul R Besser, David E Brown, Simon Siu-Sing Chan, Austin C Frenkel, Thorsten Kammler, Mehrdad Mahanpour, Jeffrey P Patton.
WO A1 - Ion-assisted plasma treatment of a three-dimensional...
patents.google.com
A boundary between a plasma and a plasma sheath is controlled such that a portion of the shape is not parallel to a plane defined by a front surface of...
US A - Package removal for FBGA devices Google...
patents.google.com
Inventores, Mehrdad Mahanpour, Mohammad Massoodi. Cesionario original, Advanced Micro Devices, Inc. Exportar cita, BiBTeX, EndNote, ...
US B1 - Separation of a multi-layer integrated circuit device...
patents.google.com
Aspects for device and package separation of a multi-layer integrated circuit device attached at a frontside to an integrated circuit package are...
US B1 - How to improve the ESD on SOI devices Google...
patents.google.com
A protection circuit structure for use with silicon-on-insulator integrated circuits is provided so as to improve electrostatic discharge protection...
US B1 - Method and system for plastic package decapsulation of...
patents.google.com
Aspects for a decapsulation system and technique are described. In a method aspect, a portable decapsulation system is provided beneath at least one...
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