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世界最大のプロフェッショナルコミュニティであるLinkedInでSeiki Hiramatsuさんのプロフィールを表示Seikiさんのプロフィールには1の求人が掲載されています。LinkedIn ...
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Seiki HIRAMATSU - Patents
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Recent bibliographic sampling of Seiki HIRAMATSU patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title): ...
Atsuko Fujino - Patents
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Atsuko Fujino patents Recent bibliographic sampling of Atsuko Fujino patents listed/published in the public domain ... Seiki Hiramatsu, Kei Yamamoto, Atsuko
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patentbuddy: Seiki Hiramatsu
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP
Related Documents
Miniature MT optical assembly (MMTOA) - Honeywell Federal...
www.freepatentsonline.com
Mar 31, · Y. Stricot, et al; Moving the Opto-Electronic Interface Inside the Connector; 73; Electronics Engineering 8941, 62; (Apr ). Seiki Hiramatsu
A High-Speed Optical Multi-Drop Bus for Computer Hot Interconnectswww.hoti.org/archive/2008papers/2008_S1_1.pdf
www.hoti.org
[9] Seiki Hiramatsu, Kiyotaka Miura, and Kazuyuki. Hirao, “Optical Backplane Connectors Using Three-. Dimensional Waveguide Arrays,” Journal of. Lightwave ...
OSA | Optical Design of Active Interposer for High-Speed Chip Level...
opg.optica.org
Optical Design of Active Interposer for High-Speed Chip Level Optical Interconnects Seiki Hiramatsu and Takashi Mikawa
Optical Backplane Connectors Using Three-Dimensional Waveguide Arrays...
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Seiki Hiramatsu ; Mitsubishi Electr. Corp., Amagasaki ; Kiyotaka Miura ; Kazuyuki Hirao. Abstract · Authors · References · Cited By · Keywords ...
Publications
ヒカリ デンキ フクゴウ ジッソウヨウ 3ジゲン ヒカリ ドウハロ ノ コウガク トクセイ ト オウヨウ - CORE
core.ac.uk
By Seiki Hiramatsu. Abstract. Kyoto University (京都大学)0048新制・論文博士博士(工学)乙第11835号論工博第3901号新制/工 UT
Organic Photonic Materials and Devices X | (2008) | Publications |...
spie.org
Proceedings of SPIE Volume Organic Photonic Materials and Devices X. Editor ... Hiroaki Okano; Shuji Suzuki; Seiki Hiramatsu Show Abstract. Effect of ...
Polysilane-based 3D waveguides for optical interconnects | (2008) |...
spie.org
Hiroaki Okano, Hirose Electric Co., Ltd. (Japan) Shuji Suzuki, Hirose Electric Co., Ltd. (Japan) Seiki Hiramatsu, Mitsubishi Electric Corp. (Japan) ...
Miscellaneous
Seiki Hiramatsu | LinkedIn
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View Seiki Hiramatsu's professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Seiki Hiramatsu discover inside
DE B4 - Wärmeleitfähige Lage und Verfahren zum Herstellen...
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Wärmeleitfähige Lage, die mittels Dispergieren eines anorganischen Füllmaterials in einem wärmeaushärtbaren Harz erhalten wird, wobei das anorganische...
US B2 - Miniature MT optical assembly (MMTOA) Google...
patents.google.com
Seiki Hiramatsu & Masao Kinoshita; Three-Dimensional Waveguide Arrays for Coupling Between Fiber-Optic Connectors and Surface-Mounted Optoelectronic Devices; ...
Polysilane-based 3D waveguides for optical interconnects
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SPIE Digital Library Proceedings
ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR APPARATUS - Patent...
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Patent application title: ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR APPARATUS Inventors: Seiki Hiramatsu (Tokyo, JP) Assignees: Mitsubishi Electric
OSA | JLT Vol. 25 Iss. 9
opg.optica.org
Seiki Hiramatsu, Kiyotaka Miura, and Kazuyuki Hirao. J. Lightwave Technol. 25(9), (2007) View: PDF. Simulation Research of Nonlinear Behavior Induced by the
US B2 - Photoelectric composite connector and substrate using...
patents.google.com
A photoelectric composite connector comprises a first connector unit which is connected to optical transmission means and a second connector unit which...
EP A4 - Photoelectric composite type connector, and substrate...
patents.google.com
A photoelectric composite type connector enabled to make precise and easy an optical alignment adjustment between an photoelectric conversion element and a...
Hiramatsu, Tokyo - Patent applications
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Patent applications by Seiki Hiramatsu, Tokyo JP Shinichi Hiramatsu, Tokyo JP. Patent application number ...
th International Symposium on Power Semiconductor Devices and ICs...
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... 2:20 Novel IGBT Modules with Epoxy Resin Encapsulation and Insulating Metal Baseplate Yusuke Kaji, Yasumichi Hatanaka, Seiki Hiramatsu, Satoshi Kondo, ...
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
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Inventors: Seiki Hiramatsu (Tokyo, JP) Mamoru Terai (Tokyo, JP) Mamoru Terai (Tokyo, Patent applications by Seiki Hiramatsu, Tokyo JP.
US B2 - Optical path changing device Google Patents
patents.google.com
Cores are embedded in a cladding, each core constituting a continuous optical path in which a first core end surface is exposed at a first end surface,...
WO A1 - Semiconductor device and process for producing the...
patents.google.com
A semiconductor device having a base board; a heat conductive resin layer superimposed on the superior surface of the base board; an integrated layer...
US B2 - Semiconductor device Google Patents
patents.google.com
An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the...
contents
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... for High-Density Packaging of OptoElectronic Interconnections AU Kenji Hiruma, Masao Kinoshita, Seiki Hiramatsu and Takashi Mikawa PP $ $ LA ...
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