Shankar Lakka and Xilinx Free People Check 

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Hc24 T2 Die Stacking - World News

wn.com
... UMC, and Choon Lee, Amkor Design Considerations Riko Radojcic, Qualcomm, and Shankar Lakka, Xilinx System Implications Bryan Black, ...

Xilinx 3D-IC System Integration at Hot Chips – EEJournal

www.eejournal.com
· Xilinx director of IC design, Shankar Lakka, and Xilinx senior director of advanced communications, Ephrem Wu, will cover topics such as Xilinx stacked silicon interconnect technology, optical integration, and engineering challenges in developing 3D …

Xilinx, Inc. : Xilinx 3D-IC System Integration at Hot Chips |...

www.marketscreener.com
SAN JOSE, Calif., Aug. 23, PRNewswire/ -- Xilinx, Inc. today announced its participation at Hot Chips 2012, August , at the Flint Center for the...
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