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	Kasama Tokyo

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HITACHI, LTD., Kasama, JP

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EP A4 - Polishing apparatus and a semiconductor manufacturing...

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The surface of a grindstone is dressed by constant cutting depth processing, preventing the surface of the grindstone from cracking, which might cause...

US A1 - Polishing apparatus and method for producing...

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The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is...

US B1 - Rotary machining apparatus Google Patents

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An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the...

MASS SPECTROMETRIC DEVICE AND MASS SPECTROMETRIC DEVICE CONTROL...

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Inventors: Akio Yamamoto (Tokyo, JP) Toshimitsu Watanabe (Tokyo, JP) Shigeo Ootsuki (Tokyo, JP) Kazuki Kajima (Tokyo, JP) Toshiaki Yanokura (Tokyo, JP) IPC8 Class: AH01J4900FI USPC Class: Class name: Radiant energy ionic separation or analysis methods Publication date: Patent application number:

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Shigeo Ootsuki Free People Check

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Miscellaneous

EP A4 - Polishing apparatus and a semiconductor manufacturing...

US A1 - Polishing apparatus and method for producing...

US B1 - Rotary machining apparatus Google Patents

MASS SPECTROMETRIC DEVICE AND MASS SPECTROMETRIC DEVICE CONTROL...