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patentbuddy: Wen-Hae Tseng

CHAUN-CHOUNG TECHNOLOGY CORP., Taipei, TW, US

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US A1 - Structure of a uniform thermal conductive heat...

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An improved structure of a uniform thermal conductive heat dissipation device, having a thermal conductor and a plurality of heat pipes. The thermal...

US A1 - Configuring apparatus and processing method of...

patents.google.com

This invention provides a configuring apparatus and a processing method for a thermal conductive plate, which uses high-temperature fusion to seal a top...

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