News
Mentoring high schooler presents opportunity for grad student | ASU...
news.asu.edu
Wen-Ching Chuang, a student at the School of Sustainability, is mentoring a local high school student through a partnership with the Southwest Center for Education
SHENMAO Technology presents a Poster at the 13 th. IWLPC ...
smtnet.com
Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng. Abstract: For several years, an approach to use fine-pitch flip chip package (150um) with copper pillar/ micro-bump is for the realization of 2.5D/3D packages of higher density and performance enhancement. Generally, flux is widely used to clean the surfaces to be ...
SHENMAO Technology presents Talk at ECWC
www.shenmao.com
Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng Time: 4/27, Session 16 Packaging Technology, ...
Shenmao Technology Inc. News - Beau Tech
www.beautech.com
... Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng ...
sorted by relevance / date