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MORE RESULTS for John KnickerbockerSPONSORED by Peoplefinders.com. Name. Age. Location. John Knickerbocker Madison Hts, MI. Address. Phone.
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Find 43 listings for John Knickerbocker in the US/Canada. WhitePages is the ...
Interests
www.tmcnet.com › usubmit › U.S. Patents Awarded to Inventors in New York (Nov. 18)
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International Business Machines, Armonk, N.Y., has been assigned a patent (8,581,392) developed by John Ulrich Knickerbocker, ...
John Ulrich Knickerbocker - Patents
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Recent bibliographic sampling of John Ulrich Knickerbocker patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):
U.S. Patents Awarded to Inventors in New York (April 15)
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... Mario John Interrante, New Paltz, N.Y., John Ulrich Knickerbocker, Monroe, N.Y., Michael Jay Shapiro, Austin, Texas, and Van Thanh Truong, ...
Chirag S. Patel - Patents
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Chirag S. Patel patents ... Inventors: Harvey Hamel, John Ulrich Knickerbocker, Samuel Mcknight, Chirag S. Patel (International Business Machines Corporation)
Business Profiles
patentbuddy: John Ulrich Knickerbocker
INTERNATIONAL BUSINESS MACHINES CORPORATION, Monroe, NY, US
Education
classmates: John Knickerbocker
David Starr Jordan High School, Long Beach, CA,
classmates: John Knickerbocker
Millington High School, Millington, MI,
classmates: John Knickerbocker
North Hollywood High School, North Hollywood, CA,
classmates: John Knickerbocker
Thomas Jefferson High School, Council Bluffs, IA,
Property
SG CVD OF METALS CAPABLE OF RECEIVING NICKEL OR ALLOYS THEREOF...
patentscope.wipo.int
This patent search tool allows you not only to search the PCT database of about 2 million International Applications but also the worldwide patent collections....
Books & Literature
books.google.ca › booksOfficial Gazette of the United States Patent and Trademark ...
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... SHEETS SUPPORTED BY CARRIERS Govindarajan Natarajan, Pleasant Valley; John Ulrich Knickerbocker, Hopewell Junction, and Robert Williams Pasco, ...
books.google.ca › booksScientific and Technical Aerospace Reports
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ORIENTATION OF CERAMIC MICROSTRUCTURES BY HOTFORMING METHODS Ph.D. Thesis John Ulrich Knickerbocker p refs (Contract ...
Orientation of Ceramic Microstructurers by Hot-forming Methods - John...
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Orientation of Ceramic Microstructurers by Hot-forming Methods. Front Cover. John Ulrich Knickerbocker. University of Illinois at Urbana-Champaign,
Compression Glazes for an Extra High Strength Electrical Porcelain -...
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Compression Glazes for an Extra High Strength Electrical Porcelain. Front Cover. John Ulrich Knickerbocker. New York State College of Ceramics at Alfred ...
Related Documents
The Knickerbocker Family in Schaghticoke - Town Of ...
townofschaghticoke.org
... died in In the next column, I will continue the story, describing the prosperous and civic-minded lives of. John Knickerbocker and his son, another John.
Miscellaneous
US A - High density electrical interconnect apparatus and...
patents.google.com
The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical...
EP A2 - Method and means for co-sintering ceramic/metal MLC...
patents.google.com
Philip Lee Flaitz, Arlyne Marie Flanagan, Joseph Matthew Harvilchuck, Lester Wynn Herron, John Ulrich Knickerbocker, Robert Wolff Nufer, Charles Hampton Perry,
DE D Chemical vapor deposition using an iodide...
patents.google.com
John Ulrich Knickerbocker Donald Rene Wall Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the ...
RE: [magicu-l] Pervasive SQL odbc error - Yahoo Groups
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From: [] On Behalf Of John Knickerbocker Sent: 20 January :54. To: Magic Users Group
John Ulrich Knickerbocker, Monroe US - Patent applications
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Patent application number Description Published; : TEMPORARY CHIP ATTACH CARRIER - A temporary chip attach carrier for and a method of testing an ...
US A1 - Test apparatus for pci-e signals Google...
patents.google.com
US *, 21 août 2008, 26 mars 2009, John Ulrich Knickerbocker, Method of testing using a temporary chip attach carrier. US *, 9 févr.
US A1 - Silicon carrier space transformer and temporary...
patents.google.com
A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection...
www.google.dj › patentsBrevet US Silicon based microchannel cooling and ...
patents.google.com
Inventeurs, John Ulrich Knickerbocker, John H. Magerlein. Cessionnaire d'origine, International Business Machines Corporation. Exporter la ...
US B1 - Interconnect structure Google Patents
patents.google.com
A method for forming an interconnect structure includes providing a substrate, and forming a raised contact member on the substrate. A conductive layer...
US B1 - Chip-to-wafer integration technology for...
patents.google.com
This embodiment addresses a novel Chip-to-wafer chip lamination technique that provides low cost and high throughput. In the Chip-to-Chip process, using...
US A - Apparatus and method for screening green sheet with via...
patents.google.com
The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention...
US B2 - Method and apparatus for depositing coplanar...
patents.google.com
Inventores, Peter A. Gruber, John Ulrich Knickerbocker. Cessionário original, International Business Machines Corporation. Exportar citação, BiBTeX, EndNote, ...
US B2 - Silicon carrier structure and method of forming same...
patents.google.com
A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip...
TEMPORARY CHIP ATTACH CARRIER - Patent application
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Patent application title: TEMPORARY CHIP ATTACH CARRIER Inventors: John Ulrich Knickerbocker (Monroe, NY, US) Assignees: International Business Machines Corporation
SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE - Patent...
www.patentsencyclopedia.com
Patent application title: SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE Inventors: John Ulrich Knickerbocker (Monroe, NY, US) John H. Magerlein (Yorktown
www.patentsencyclopedia.com › appBRIDGES FOR INTERCONNECTING INTERPOSERS IN ...
www.patentsencyclopedia.com
Inventors: Douglas James Joseph (Danbury, CT, US) John Ulrich Knickerbocker (Monroe, NY, US) IPC8 Class: AH01L23538FI USPC Class: ...
Indian Patents :POLYMER AND CERAMIC COMPOSITE ELECTRONIC...
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7, JOHN ULRICH KNICKERBOCKER, 53 GREAMERY ROAD, HOPEWELL JUNCTION, NEW YORK , CHARLES H PERRY, 14 SPY HILL ROAD, ...
Knickerbocker, NY - Patent applications
www.patentsencyclopedia.com
John Knickerbocker, Yorktown Heights, NY US. Patent application number ... the handler from the wafer John Knickerbocker, Monroe, NY US ...
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